Zhejiang Zapon Electronic Technology Co., Ltd.  

Product Name: BGA Multilayer Mobile Phone PCB Board Model NO.: Multilayer PCB-23 Mechanical Rigid: Rigid Flame Retardant Properties: V0 Material: Fiberglass Epoxy Dielectric: FR-4 Type: Rigid Circuit Board PP Thickness: 7628(0.18mm) 2116(0.12mm) 1080(0.08mm) Core base Board: 0.3mm 0.5mm 0.6mm 0.8mm 1.0mm Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS) Sample Date: 5-7days Trademark: ZAPON Transport Package: Vacuum Packing Specification: UL, TS16949, IPC 600 CLASS 2 Origin: CHINA HS Code: 85340090 Product Description ZHEJIANG ZAPON ELECTRonIC TECHNOLOGY CO LTD is a famous comapany with rich experiece in PCB manufacture , and our company is a professional PCB&PCBA supplier in single-sided PCB, double-sided PCB, mulitlayer PCB and Aluminum based Printed Board, the range of our product can up to 22 layers.Our month production capacity is 50,000m2 .We stick to providing our customers with high quality , competitive PCB products and our good service .ItemCapabilitiesNumber of LayersFrom 4-layer to 22- LayerMaterialFR-4,HighTg, RogersHalogen FreePCB ThicknessMin.thickness0.4mm(16mil)Max.thickness3.2mm(128mil)Surface finishedGold PlatingImmersion Gold(Silver)HAL Lead FreeHot Air Solder Leveling(HASL)Entek Coating (OSP)Solder MaskGreen,White,Black,Yellow,Red,BlueOther printingGold FingerCarbon Print, Peelable MaskSolder Mask Plugged HoleCopper thickness1/ 2 oz (18 μm) - 4 oz (140 μm)Min. Finished Hole Size0.2mm(8mil)Hole Size Tolerance (PTH)+/ -0.076mm (3 mil)Hole Size Tolerance (NPTH)+/-0.05mm (2 mil)Min. Line Width and Spacing0.1mm (4 mil)Min. Solder Mask Clearance0.05mm (2 mil)Min. Annular Ring0.076mm (3mil)Profile and V-CutCNC-Routing, Stamping and Beveling,V-CUT,CNCSpecial ProcessMicro-section, Chamfer for Gold Finger File format Gerber file, CAM350 ,Protel,PowerPCB E-TESTFlying Prob, E-test ,Fixture Other Test Impedance, Slice up Warp & Twist≤0.7%