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详细信息 Product Name: High Quality Multi-Layer Immersion Gold PCB Model NO.: Multi-Layer PCB-50 Insulation Materials: Organic Resin Mechanical Rigid: Rigid Flame Retardant Properties: V0 Material: Fiberglass Epoxy Resin + Polyimide Resin Dielectric: FR-4 Type: Rigid Circuit Board PP Thickness: 7628(0.18mm) 2116(0.12mm) 1080(0.08mm) Core base Board: 0.3mm 0.5mm 0.6mm 0.8mm 1.0mm Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS) Sample Date: 5-7days Trademark: ZAPON Transport Package: Vacuum Packing Specification: UL ISO TS16949 IPC Origin: China HS Code: 85340090 Product Description ZHEJIANG ZAPON ELECTRonIC TECHNOLOGY Co., Ltd is a professional manufacture of PCB and PCBA. Which have the factory of single side PCB, double side PCB, multi-layer PCB and PCB assembly etc. We have the ability of produce for any medium and mass quantity. The machine of our factory are on work all day and all night. With Zapon as a supplier, you will have the highest quality, quickest delivery.ItemCapabilitiesNumber of LayersFrom 4-layer to 22- LayerMaterialFR-4, HighTg, RogersHalogen FreePCB ThicknessMin. thickness0.4mm(16mil)Max. thickness3.2mm(128mil)Surface finishedGold PlatingImmersion Gold(Silver)HAL Lead FreeHot Air Solder Leveling(HASL)Entek Coating (OSP)Solder MaskGreen, White, Black, Yellow, Red, BlueOther printingGold FingerCarbon Print, Peelable MaskSolder Mask Plugged HoleCopper thickness1/ 2 oz (18 μ m) - 4 oz (140 μ m)Min. Finished Hole Size0.2mm(8mil)Hole Size Tolerance (PTH)+/ -0.076mm (3 mil)Hole Size Tolerance (NPTH)+/-0.05mm (2 mil)Min. Line Width and Spacing0.1mm (4 mil)Min. Solder Mask Clearance0.05mm (2 mil)Min. Annular Ring0.076mm (3mil)Profile and V-CutCNC-Routing, Stamping and Beveling, V-CUT, CNCSpecial ProcessMicro-section, Chamfer for Gold Finger File format Gerber file , CAM350, Protel, PowerPCB E-TESTFlying Prob , E-test, Fixture Other Test Impedance , Slice up Warp & Twist ≤ 0.7%
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