Zhejiang Zapon Electronic Technology Co., Ltd.  

Product Name: 1.6mm Aluminium PCB for Lighting Industry Model NO.: Aluminium PCB-3 Mechanical Rigid: Rigid Processing Technology: Electrolytic Foil base Material: Aluminum Dielectric: Aluminium Flame Retardant Properties: V0 Type: Rigid Circuit Board Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K Ccl Brand: Jh,Ccaf.etc Sample Date: 3-5days Trademark: ZAPON Transport Package: Vacuum Packing Specification: UL, TS16949, IPC 600 CLASS 2 Origin: CHINA HS Code: 85340090 Product Description Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.It's widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.Note: We specially produces metal base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-A, CCAF-05etc. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc.Thickness of the copper: 18um, 35um, 70um, 105um.base size: 500mm × , 600mm (20"× , 24"); 600mm × , 1060mm (24"× , 42")CCAF-04-A Aluminum-base copper-clad laminateThe test base: CCAF-04 the high heat dissipation Aluminum-base copper-clad laminateThickness of the copper: 35umThickness of the diclectric: 80um(matrial of the high heat dissipation)Thickness of the aluminum-base: 1.5mmThe result of the test:Test itemTechnology requestUnitTest result1Peel StrengthA≥ 1.0N/mm1.05After thermal stress (260 ordm;C )≥ 1.0N/mm1.052Blister test AfterThermal stress (288ordm;C, 2min)288ordm;C 2 minNo delaminating/OK3Themal Resistance≤ 2.0ordm;C/W0.654Flammability(A)FV-O/FV-O5Surface ResistivityA≥ 1 × 10 5M Ω5.0 × 10 7Constant humidity treatment(90%,3 5ordm;C ,96h)≥ 1 × 10 5M Ω4.5 × 10 667Volume ResistivityA≥ 1 × 10 6M Ω@ m1.0 × 10 8Constant humidity treatment(90%,3 5 ordm;C ,96h)≥ 1 × 10 6M Ω@ m1.9 × 10 78Dielectric Breakdown (DC)≥ 25Kv/mm319Dielectric constant(1MHz)(40 ordm;C, 93%, 96h)≤ 4.4/4.210Dielectric dissipation factor (1MHz )(40ordm;C ,93%,96h)≤ 0.03/0.029Accelerated aging experiment(125 ordm;C ,2000h)The laminate bace should no wrinkles,no crack,no delaminating or no pine/OK11High low temperature impact test(-50 ordm;C, 15min, 80ordm;C, 15minTOTAL DO 15~ 20 Circulation)Peel Strength/N/mm1.39~ 1.64Surface Resistivity/M Ω1.9 × 10 8 ~6.4 × 10 8